Esec Singapore Pte Ltd

Esec Singapore Pte Ltd is the Singapore arm of the Swiss specialist in semiconductor die bonding and wire bonding equipment for the back-end semiconductor assembly process. Esec Singapore Pte Ltd provides die attach equipment, wire bonders, and advanced semiconductor packaging tools for Singapore’s back-end assembly and test facilities. The company’s precision bonding equipment is used in Singapore’s semiconductor assembly operations producing integrated circuits, power modules, and sensor devi.